Thermomechanical Fatigue Studies on Pb-free Automotive Electronic Solders Department of Chemical Engineering and Materials Science, Michigan State University

Format:

Conference/Event

Author/Creator:

Lee, J. G., author.

Conference Name:

SAE 2003 World Congress & Exhibition (2003-03-03 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2003

Summary:

Electronic solders used in automotive under-the-hood applications experience severe thermal excursions. Under such conditions thermomechanical fatigue (TMF) is a major concern. Aging, creep/stress relaxation, and imposed temperature-time profile have been found to be major contributors for such failures. However, in the currently popular Sn-based solders, the anisotropic behavior of Sn and reversed shear also play significant roles. Our studies evaluate the role of all these parameters, and consider the role of alloying elements and reinforcements on the TMF behavior of Sn-based solders. This paper provides an overview of this effort

Notes:

Vendor supplied data

Publisher Number:

2003-01-0621

Access Restriction:

Restricted for use by site license