Thermoformed Soft Instrument Panel GE Plastics

Format:

Conference/Event

Author/Creator:

Woodman, Daniel, author.

Conference Name:

SAE 2003 World Congress & Exhibition (2003-03-03 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2003

Summary:

The automotive industry is continually striving for opportunities to take additional cost and mass out of vehicle systems. Large parts such as an Instrument Panel retainer are good candidates because a small percent reduction in mass can translate into a significant material mass savings. Multiple requirements for a soft instrument panel including safety, stiffness, adhesion, et cetera can make these savings difficult to achieve.This paper will describe how a new material and process development for the fabrication of a soft instrument panel can produce 50% weight savings with a 20% cost reduction potential. In addition, this new technology exhibits improved performance over existing materials during safety testing

Notes:

Vendor supplied data

Publisher Number:

2003-01-1171

Access Restriction:

Restricted for use by site license