Development of New Generation PP Material for Instrumental Panel and Bumper Application Toyota Motor Corporation

Format:

Conference/Event

Author/Creator:

Umetani, Yusuke, author.

Conference Name:

SAE 2003 World Congress & Exhibition (2003-03-03 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2003

Summary:

Toyota has developed new PP Compound materials for Instrument Panel (IP) and Bumper applications. The target of this development is to keep the same level of superior performance as the current Toyota materials, to make these materials available in all main regions, and to achieve the remarkable cost reduction. One of the main points of this development is to adopt the advanced material of "High-Elastomer-contained and High-Crystalline PP (HEHCPP)". Using this advanced PP significantly reduces the amount of expensive "Added Rubber" that is necessary, and it helps simplify the PP compounding process. By the optimization of the raw material contents and the molecular weight of polymerized rubber, it has been confirmed in all regions that the newly developed materials show equivalent mechanical properties and processability to Toyota's current IP and Bumper materials

Notes:

Vendor supplied data

Publisher Number:

2003-01-0210

Access Restriction:

Restricted for use by site license