Review of Development, Properties and Packaging of Thinwall and Ultrathinwall Ceramic Substrates Corning GmbH

Format:

Conference/Event

Author/Creator:

Knon, Heidi, author.

Conference Name:

SAE Brasil 2002 Congress and Exhibit (2002-11-19 : Sao Paulo, Brazil)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2002

Summary:

Driven by the worldwide automotive emission regulations, ceramic substrates were developed to serve as catalyst support. Since the introduction of Standard wall substrates in 1974, substrates with thinner walls and higher cell densities have been developed to meet the tighter emission requirements; Worldwide, the amount of Thinwall and Ultrathinwall substrates in series applications is increasing continuously.The properties of the substrates determine their performance regarding pressure drop, heat-up and conversion efficiency. These properties are analyzed, as well as the packaging process for Thinwall and Ultrathinwall substrates; A new packaging technique with lower pressure load is described

Notes:

Vendor supplied data

Publisher Number:

2002-01-3578

Access Restriction:

Restricted for use by site license