Collaboration Between Advanced Design and Manufacturing to Achieve Greater Velocity in High Technology Adaptation into the Automotive Environment Jabil Technology Services

Format:

Book

Conference/Event

Author/Creator:

Lumetta, Jeff, author.

Conference Name:

Convergence International Congress & Exposition On Transportation Electronics (2002-10-21 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource cm

Place of Publication:

Troy, MI Convergence Transportation Electronics Association 2002

Summary:

The time-to-market (TTM) for integrating advanced electronic solutions into the automotive environment is challenging due to the legacy validation environment and the tendency for automotive developers to take a conservative approach to new technology adaptation. EMS technology development groups, which have taken a ground-up approach to new business and technology models, may provide a fresh perspective into potential solutions to this challenge.Traditional serialized development processes and manufacturing collaboration was the cornerstone of product development life cycles in traditional OEMs--whether in the consumer, commercial, medical, or automotive markets. As OEMs divested manufacturing and now technology development, a new breed of process was formed to more efficiently handle multi-disciplined markets, products and solutions. To a large extent, the commercial and consumer markets have seen the results of these new efforts which, in turn, have competitively forced OEMs to recognize these new development methodologies. Although the medical and automotive markets have been slow to adapt new models, this is changing as the successes in other areas surface.Jabil Technology Services is prepared to show how we are developing new ways to adapt high technology solutions based on a highly parallel execution model that reduces TTM while preserving quality goals set forth in the relevant markets. This new model allows quicker technology innovation in the marrying of conceptual ideas, simulation, advanced design, advanced packaging and system integration

Notes:

Vendor supplied data

Publisher Number:

2002-21-0008

Access Restriction:

Restricted for use by site license