Thermal Shock Resistance of Advanced Ceramic Catalysts for Close-Coupled Application Corning Incorporated

Format:

Conference/Event

Author/Creator:

Gulati*, S.T., author.

Conference Name:

SAE 2002 World Congress & Exhibition (2002-03-04 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2002

Summary:

This paper examines the relative thermal shock requirements for ceramic catalysts in underbody vs. close-coupled positions. The higher operating temperature in the latter position may imply higher coefficient of thermal expansion and higher thermal stresses, depending on substrate/washcoat interaction, than those for underbody position. An analysis of thermal stresses, using relevant physical properties and temperature gradients, is presented for both close-coupled and underbody catalysts. Three different high temperature close-coupled catalysts, employing advanced ceramic substrates with 600/3, 600/4 and 900/2 cell structure, and an underbody catalyst with 400/6.5 standard ceramic substrate are examined. Such an analysis is valuable for designing the optimum aspect ratio (length/diameter) and packaging system, which will minimize thermal and mechanical stresses over the desired lifetime of 120K vehicle miles. The analysis shows that the recommended aspect ratio for close-coupled application may be different from that for underbody application depending on operating conditions and the packaging design

Notes:

Vendor supplied data

Publisher Number:

2002-01-0738

Access Restriction:

Restricted for use by site license