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New Design of Ultra High Cell Density Metal Substrates Emitec GmbH, Lohmar
- Format:
- Conference/Event
- Author/Creator:
- Schaper, Katrin, author.
- Conference Name:
- SAE 2002 World Congress & Exhibition (2002-03-04 : Detroit, Michigan, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 2002
- Summary:
- To meet the most stringent emissions standards such as Super Ultra Low Emission Vehicle (SULEV) in California, substrates with high cell densities and ultra thin foils are needed, mounted in a close-coupled position. A new substrate design has been developed incorporating increased thermal and mechanical load in association with reduced thermal mass and improved heat transfer due to higher cell density. This paper describes the development of the new design using finite element calculation and practical test results from component and engine test benches
- Notes:
- Vendor supplied data
- Publisher Number:
- 2002-01-0353
- Access Restriction:
- Restricted for use by site license
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