Cofireable Dielectric on Steel Thick Film Materials System for Automotive Applications Heraeus Incorporated, Circuits Material Division

Format:

Conference/Event

Author/Creator:

Sims, Theresa D., author.

Conference Name:

SAE 2002 World Congress & Exhibition (2002-03-04 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2002

Summary:

Alumina substrates while widely used in the production of thick film hybrid circuits have limited use in thermally and mechanically demanding applications. Recent technological developments and availability of insulating dielectric compositions that can be processed on stainless steel has made stainless steel an attractive alternative to alumina. The use of stainless steel in the processing of hybrid circuits provides increased mechanical strength, improved resistance to thermal shock and reduced material costs. Sequentially fired and co-fireable dielectrics on steel have been developed that meet the electrical, thermal and mechanical demands necessary to use steel substrates in hybrid circuit applications while maintaining the benefits of existing thick film technology

Notes:

Vendor supplied data

Publisher Number:

2002-01-1049

Access Restriction:

Restricted for use by site license