Adhesives for Underhood Bonding Dow Corning SA Electronics Industry

Format:

Conference/Event

Author/Creator:

Paquet, René, author.

Conference Name:

SAE 2001 World Congress (2001-03-05 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2001

Summary:

The objective of this paper is to suggest solutions for bonding problems encountered by engineers and designers of underhood components and assemblies. It will answer questions related to bonding of diverse materials like plastics, metals and ceramics. Various surface characteristics coupled to mechanical and thermal mismatching of those materials often pose unique technical challenges

Notes:

Vendor supplied data

Publisher Number:

2001-01-1145

Access Restriction:

Restricted for use by site license