OCP - Materials Outokumpu Copper Strip AB

Format:

Conference/Event

Author/Creator:

Falkenö, Anders, author.

Conference Name:

SAE 2001 World Congress (2001-03-05 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2001

Summary:

Outokumpu Copper Strip AB has developed Copper alloys for use in heat exchanger applications where high temperature joining is employed. The alloys are basically low alloyed Copper and Brass. These alloys are particularly suitable for the brazing of Copper and Brass heat exchangers. For joining purposes an alloy has been developed as brazing filler material. That alloy has properties that give high strength at comparatively low brazing temperatures. All these alloys are being used in the CuproBraze process of manufacturing copper and brass heat exchangers. This paper will explain the properties of these materials and their use

Notes:

Vendor supplied data

Publisher Number:

2001-01-1022

Access Restriction:

Restricted for use by site license