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New, High Efficiency, Low Cost Liquid Heat Exchanger for Cooling Power Semiconductor Devices Solid State Cooling Systems
- Format:
- Book
- Conference/Event
- Author/Creator:
- Wright, Clifford C., author.
- Conference Name:
- Vehicle Thermal Management Systems Conference & Exposition (2001-05-15 : Nashville, Tennessee, United States)
- Language:
- English
- Physical Description:
- 1 online resource cm
- Place of Publication:
- Warrendale, PA SAE International 2001
- Summary:
- A novel extruded aluminum heat exchanger for cooling power semiconductor devices used in hybrid vehicles is described. The patented and patent pending design employs an enhanced heat transfer surface and turbulence generating devices to efficiently remove heat from devices, such as IGBTs, and reject it into the vehicles coolant loop. Heat transfer rates approach brazed plate-fin designs while the pressure drop remains low at high coolant flow
- Notes:
- Vendor supplied data
- Publisher Number:
- 2001-01-1743
- Access Restriction:
- Restricted for use by site license
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