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Advanced Components and Techniques for Cryogenic Integration Swales Aerospace

SAE Technical Papers (1906-current) Available online

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Format:
Conference/Event
Author/Creator:
Bugby, D., author.
Conference Name:
31st International Conference On Environmental Systems (2001-07-09 : Orlando, Florida, United States)
Language:
English
Physical Description:
1 online resource
Place of Publication:
Warrendale, PA SAE International 2001
Summary:
This paper describes the development and testing status of several novel components and integration tools for space-based cryogenic applications. These advanced devices offer functionality in the areas of cryogenic thermal switching, cryogenic thermal transport, cryogenic thermal storage, and cryogenic integration. As such, they help solve problems associated with cryocooler redundancy, across-gimbal thermal transport, large focal plane array cooling, fluid-based cryogenic transport, and low vibration thermal links. The devices discussed in the paper include a differential thermal expansion cryogenic thermal switch, an across-gimbal thermal transport system, a cryogenic loop heat pipe, a cryogenic capillary pumped loop, a beryllium cryogenic thermal storage unit, a high performance flexible conductive link, a kevlar cable structural support system, and a high conductance make-break cryogenic thermal interface
Notes:
Vendor supplied data
Publisher Number:
2001-01-2378
Access Restriction:
Restricted for use by site license

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