Mechanical Behaviour of Sn-Pb and Sn-Ag Soldering Alloys for Printed Circuit Boards of the Automotive Industry Departamento de Ciencia de los Materiales e Ingeniería Metalúrgica Centre Tecnològic de Manresa Universitat Politécnica de Catalunya

Format:

Conference/Event

Author/Creator:

Cabrera, J. M., author.

Conference Name:

Automotive and Transportation Technology Congress and Exposition (2001-10-01 : Barcelona, Spain)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2001

Summary:

In the present work, a comparative study of the constitutive equations describing the flow behaviour at relatively high homologous temperatures of eutectic tin-lead and tin-silver alloys is carried out. For this purpose uniaxial compression tests were performed on the latter two alloys at diverse strain rates and temperatures. Results showed that at relatively low temperatures the deformation response can be considered to be controlled by the same mechanism. However, the tin-lead eutectic, displayed superplastic behaviour at high temperatures

Notes:

Vendor supplied data

Publisher Number:

2001-01-3220

Access Restriction:

Restricted for use by site license