Thermal Simulation of the Electrical Distribution Box YAZAKI Corporation

Format:

Conference/Event

Author/Creator:

Ikeya, T., author.

Conference Name:

SAE 2001 World Congress (2001-03-05 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2001

Summary:

Our paper describes our R&D results regarding thermal simulation of the electrical distribution box (EDB). We have developed simulation techniques by using the finite element method (FEM). In order to achieve a high level of accuracy in the thermal simulation, we built an appropriate model of the EDB. Because bus-bars and connectors with wires play important roles in the EDB, the bus-bars used in the model were exact replicas of those used in the EDB. As a result, a high accuracy, (± 5 degrees Celsius,) was achieved in the simulation. We simulated another EDB model using the same simulation conditions, which we have defined. The accuracy of the simulation achieved was ± 5 degrees Celsius as well. Our study suggests that our thermal simulation technology is certainly a powerful tool for the design of EDB. Optimal thermal conditions achieved by changing both the size and materials of the bus-bars and connectors based on the simulation results will provide high quality, including improved reliability, for various EDB products

Notes:

Vendor supplied data

Publisher Number:

2001-01-0690

Access Restriction:

Restricted for use by site license