Environment-Friendly Fluxless Soldering Process for High Sealing Ability on Pressure Sensors DENSO CORPORATION

Format:

Conference/Event

Author/Creator:

Yoneyama, Takao, author.

Conference Name:

SAE 2001 World Congress (2001-03-05 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2001

Summary:

In a conventional soldering process, solvents, such as chlorofluorocarbons (CFCs), have been necessary to remove the flux-residue after soldering.A new CFC-free fluxless soldering process has been developed to obtain high sealing ability even in a small soldering area. This new process utilizes a reducing atmosphere with an appropriate load and assembly orientation to solder the parts. Under this fluxless condition, it is found that appropriate loading and good solder-wettability of the upper part increase the wettability of the lower part

Notes:

Vendor supplied data

Publisher Number:

2001-01-0341

Access Restriction:

Restricted for use by site license