Thin Film Pressure Sensor Technology Applied to Catalytic Converter Packaging Corning incorporated

Format:

Conference/Event

Author/Creator:

Locker, Robert J., author.

Conference Name:

SAE 2001 World Congress (2001-03-05 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2001

Summary:

Application of new ultra-thinwall ceramic substrate technology to many new vehicle exhaust emission applications has lead to an interest in better understanding the pressures to which substrates are exposed during packaging operations. A recently identified thin film load cell technology has permitted a more analytical evaluation of pressure distributions that develop during ceramic substrate packaging. The optimum configuration of this technique for studying canning operations will be investigated as part of the study. In addition to identifying the characteristic pressure distributions created during canning processes, the impact of various process parameters on this distribution was also investigated

Notes:

Vendor supplied data

Publisher Number:

2001-01-0223

Access Restriction:

Restricted for use by site license