Parametric Thermal Analysis and Optimization Using Thermal Desktop C&R Technologies

Format:

Conference/Event

Author/Creator:

Panczak, Timothy D., author.

Conference Name:

International Conference On Environmental Systems (2000-07-10 : Toulouse, France)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2000

Summary:

Thermal analysis is typically performed using a point design approach, where a single model is analyzed one analysis case at a time. Changes to the system design are analyzed by updating the thermal radiation and conduction models by hand, which can become a bottleneck when attempting to adopt a concurrent engineering approach. This paper presents the parametric modeling features that have been added to Thermal Desktop to support concurrent engineering. The thermal model may now be characterized by a set of design variables that are easily modified to reflect system level design changes. Geometric features, optical and material properties, and orbital elements may all be specified using user-defined variables and expressions. Furthermore, these variables may be automatically modified by Thermal Desktop's optimization capabilities in order to satisfy user-defined design goals, or for correlating thermal models to test data. By sharing the set of design variables among analysis models spanning multiple disciplines, further integrated analysis and design may be accomplished. The framework into which Thermal Desktop is embedded in order to support an integrated Thermal/Structural/Optical design, analysis, and optimization system is also presented

Notes:

Vendor supplied data

Publisher Number:

2000-01-2447

Access Restriction:

Restricted for use by site license