Development of Lead-Free Soldering Technology and Its Application Matsushita Electric Industrial Company, Limited

Format:

Book

Conference/Event

Author/Creator:

Suetsugu, Kenichiro, author.

Conference Name:

Convergence 2000 International Congress on Transportation Electronics (2000-10-16 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource cm

Place of Publication:

Troy, MI Convergence Transportation Electronics Association 2000

Summary:

In recent years, the solder used to mount electronic componentsonto printed circuit boards has become a social issue because ofthe lead it contains. To resolve the problem, the development of alead-free solder and bonding technology that utilizes it are notonly research themes of industry but national research programs aswell.In light of the circumstances, we developed an Sn-Ag solder withminute quantities of Bi and other additives, and applied it for thefirst time in the industry to a printed circuit board for portableMD player. The developed solder has proven workable under currentproduction temperature conditions (profile that peaks at 230degrees centigrade) and reliable for bonding electronic componentleads in mass-production. Other studies are currently underway intoidentifying the bonding mechanism and reliability evaluationmethods and standards, and to establish reflow processingtechnology for large boards, which are characterized by widetemperature variation, for eventual use with factory automationcontrollers and other products. One reflow process using a Sn-Cusolder has been brought to practical application with VCRs. Usewill eventually be expanded to other products in the future

Notes:

Vendor supplied data

Publisher Number:

2000-01-C043

Access Restriction:

Restricted for use by site license