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Miniature Embedded Heat Pipes in Low Temperature Co-Fired Ceramic for Electronic Devices Requiring Temperature Stability Harris Corporation
- Format:
- Book
- Conference/Event
- Author/Creator:
- Snyder, Steven R., author.
- Conference Name:
- Power Systems Conference (2000-10-31 : San Diego, California, United States)
- Language:
- English
- Physical Description:
- 1 online resource cm
- Place of Publication:
- Warrendale, PA SAE International 2000
- Summary:
- A miniature heat pipe constructed from a multi-layered, co-fired ceramic process utilizing brazed-on evaporator and condenser slugs is investigated. The substrate-embedded heat pipe is shown to effectively dissipate the heat generated by a power MOSFET, used as the heat source, while maintaining a nearly constant junction temperature over a power load range from 6 to 10 watts. Independent modeling of the evaporation, vapor flow, condensation, and capillary flow are used to guide the heat pipe development. Predicted operation and experimental operation of the heat pipe are compared
- Notes:
- Vendor supplied data
- Publisher Number:
- 2000-01-3621
- Access Restriction:
- Restricted for use by site license
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