1 option
A Unified Approach to Solder Joint Life Prediction Wayne State University
- Format:
- Conference/Event
- Author/Creator:
- Qian, Zhengfang, author.
- Conference Name:
- SAE 2000 World Congress (2000-03-06 : Detroit, Michigan, United States)
- Language:
- English
- Physical Description:
- 1 online resource
- Place of Publication:
- Warrendale, PA SAE International 2000
- Summary:
- A unified approach has been developed and applied to solder joint life prediction in this paper, which indicates a breakthrough for solder joint reliability simulation. It includes the material characterization of solder alloys, the testing of solder joint specimens, a unified viscoplastic constitutive framework with damage evolution, numerical algorithm development and implementation, and experimental validation. The emphasis of this report focuses on the algorithm development and experimental verification of proposed viscoplasticity with damage evolution
- Notes:
- Vendor supplied data
- Publisher Number:
- 2000-01-0454
- Access Restriction:
- Restricted for use by site license
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