A Warpage Measurement System with Large Dynamic Range for Boards with Components Wayne State University

Format:

Conference/Event

Author/Creator:

Lu, Minfu, author.

Conference Name:

SAE 2000 World Congress (2000-03-06 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2000

Summary:

A new algorithm for carrier removal, a key step in the Fourier transform method of fringe pattern analysis, is presented in this paper. The accuracy of frequency estimations is critical to carrier removal to avoid potential significant errors in the recovered phase. A new algorithm on Fourier transform and curve fitting technique is developed. To avoid an ill-conditioned result in solving the least-square problem, an orthogonal polynomial curve fitting algorithm is developed. A new system that combines projected grating moiré (PM) with shadow moiré (SM), recently designed and built with large dynamic range for both component level and board level warpage measurement for the reliability study of electronic packaging materials and structures, is presented and demonstrated

Notes:

Vendor supplied data

Publisher Number:

2000-01-0458

Access Restriction:

Restricted for use by site license