New Process of Copper Based Conductor for Power Device R&D Center Kagoshima, Kyocera Corporation

Format:

Conference/Event

Author/Creator:

Sasaki, Yasuhiro, author.

Conference Name:

SAE 2000 World Congress (2000-03-06 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2000

Summary:

A new process for a highly reliable ceramic substrate with electric circuit has been developed for power devices of automotive applications. The circuit conductor has high conductivity to accept a current of 10 to 200 Amperes, and has strong joining strength to ceramic substrates. The conductor is made of sintered copper powders with several kinds of diameters to get a porous structure, for reducing Young's modulus and thermal stress between the circuit conductor and ceramic substrate. Sintering shrinkage of the circuit conductor has been restrained, and joining strength to the ceramic substrates kept strong by an anchor effect. The copper circuit conductor realized electric resistivity of 2.310-6 ohm-cm, and coefficient of thermal conductivity, 290 W/mK. We have also confirmed superior reliabilities in the joining strength and conductivity by thermal cycling tests

Notes:

Vendor supplied data

Publisher Number:

2000-01-0136

Access Restriction:

Restricted for use by site license