WRAPFORM-II: A New Binder FormingSimulation Method General Motors R&D Center

Format:

Conference/Event

Author/Creator:

Chen, Kuo-Kuang, author.

Conference Name:

SAE 2000 World Congress (2000-03-06 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2000

Summary:

WRAPFORM is a mathematical model and computer program for calculating binder wrap surface shape. It employs punch-opening line of the die as a geometric input and does not use the complete binder surface. This paper presents WRAPFORM-II, an improvement of the WRAPFORM model by including the binder surface geometry in the simulation. The new model has been applied to several dies and results are compared to those of the base WRAPFORM model. For a decklid die reported in the literature, whose simulated binder wrap showed bifurcation possibilities, straightforward application of WRAPFORM-II predicts a more plausible result which is consistent with the original design intent. In another case, WRAPFORM-II predicted the feasibility of a design to put more material into the die cavity. Other applications show slightly improved simulation results by using WRAPFORM-II

Notes:

Vendor supplied data

Publisher Number:

2000-01-1106

Access Restriction:

Restricted for use by site license