Simulating the Die Gap Effect on Springback Behavior in Stamping Processes DaimlerChrysler Corporation

Format:

Book

Conference/Event

Author/Creator:

Hu, Yang, author.

Conference Name:

SAE 2000 World Congress (2000-03-06 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource cm

Place of Publication:

Warrendale, PA SAE International 2000

Summary:

The springback behavior might be different due to different gap clearances between die and punch. A study using FEA simulation is done to investigate the die gap effect. A 3D brick element and an explicit-implicit method are employed to investigate a few simple problems. A draw form, a crash form with an upper pad and a flange form are investigated separately. Numisheet'93 2D draw bending springback problem is also investigated using an explicit dynamic code. Comparisons between springback simulation results on several different die gaps are illustrated. The Kirchhoff assumption of C° shell element and the Mindlin/Love assumption of thin shell element are also examined on different cases. A case study then is performed on a rail type panel. Conclusions and recommendations for future studies are summarized

Notes:

Vendor supplied data

Publisher Number:

2000-01-1111

Access Restriction:

Restricted for use by site license