Stress Isolation of an Accelerometer Die in a Post-molded Plastic Package - The Impact of Die Coat Coverage

Format:

Conference/Event

Author/Creator:

Vujosevic, Milena, author.

Conference Name:

International Congress & Exposition (1999-03-01 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1999

Summary:

This study addresses the influence that die coat coverage in a medium g accelerometer post-molded plastic package has on the mechanical response of the substrate where the sensing element is anchored. It explains the importance of the isolation gap between the mold compound and the die coat and relates the gap existence to the thickness of the die coat. The analysis suggests a criterion for a minimum thickness of the die coat that should be utilized in manufacturing

Notes:

Vendor supplied data

Publisher Number:

1999-01-0157

Access Restriction:

Restricted for use by site license