Flexible Multilayer Designs Provide Cost Effective Packaging Solutions

Format:

Conference/Event

Author/Creator:

DiPalermo, Joseph A., author.

Conference Name:

International Congress & Exposition (1999-03-01 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1999

Summary:

This paper discusses a variety of manufacturing techniques which have been developed to produce cost effective multilayer interconnects while overcoming the harsh environmental conditions imposed by the Automotive Industry. A comparison is made to the transition of Military Rigid-flex technology and materials needed to overcome the aerospace environment

Notes:

Vendor supplied data

Publisher Number:

1999-01-0162

Access Restriction:

Restricted for use by site license