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The Heat Pump Thermal Bus - An Alternative to Pumped Coolant Loops Mainstream Engineering Corporation

SAE Technical Papers (1906-current) Available online

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Format:
Conference/Event
Author/Creator:
Scaringe, Robert P., author.
Conference Name:
Aerospace Power Systems Conference (1999-04-06 : Mesa, Arizona, United States)
Language:
English
Physical Description:
1 online resource
Place of Publication:
Warrendale, PA SAE International 1999
Summary:
This paper will describe a patent-pending approach of using a vapor compression system to also provide a forced two-phase indirect heat transfer loop. This system can be configured with water boiler peak cooling thermal control hardware to avoid the high ambient temperatures associated with supersonic low altitude flight. Due to the very short duration of this high ambient condition, water boiler transient cooling techniques have potential. The water boiler can also be used for ground based cooling when flight-line ground cooling carts are unavailable. The use of a PID controller to accurately control the cold plate temperatures when used with a solenoid activated by-pass circuit will be described
Notes:
Vendor supplied data
Publisher Number:
1999-01-1356
Access Restriction:
Restricted for use by site license

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