The Evolution of Microchannel Heat Transfer Mainstream Engineering Corporation

Format:

Conference/Event

Author/Creator:

Cole, Gregory S., author.

Conference Name:

Aerospace Power Systems Conference (1999-04-06 : Mesa, Arizona, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1999

Summary:

High-density electronics packaging requires new advancement in thermal management. New efforts to standardize three-dimensional electronics packages provide the opportunity to standardize thermal management systems for the first time. Microchannel cooling, a high heat flux technology, is the leading candidate for standardization of earth- and space- based electronics packages. This paper looks at the developments in microchannel cooling that make it more advantageous than other high heat flux techniques and the work that remains to achieve a standardized thermal management system

Notes:

Vendor supplied data

Publisher Number:

1999-01-1357

Access Restriction:

Restricted for use by site license