VGCF/Carbon Composites for Thermal Management Applied Sciences, Incorporated

Format:

Conference/Event

Author/Creator:

Lake, Max L., author.

Conference Name:

Aerospace Power Systems Conference (1999-04-06 : Mesa, Arizona, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1999

Summary:

VGCF/Carbon composites have been shown to demonstrate high thermal conductivity, comparable to that of CVD diamond, implying utility in high performance electronic packaging. VGCF/carbon composites are unlike diamond in that, typical of most fiber reinforced composites, designed physical properties are incorporated into the composite through fiber architecture. Thermal performance for die cooling is frequently determined by the thermal impedance of the package, measured from the junction to ambient, ja, or jucntion to case, jc. This paper reports the results of this test on VGCF/carbon composites with a 1D architecture

Notes:

Vendor supplied data

Publisher Number:

1999-01-1359

Access Restriction:

Restricted for use by site license