Micromachined Heat Sinks Advanced MicroMachines Incorporated

Format:

Conference/Event

Author/Creator:

Bang, Christopher A., author.

Conference Name:

Aerospace Power Systems Conference (1999-04-06 : Mesa, Arizona, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 1999

Summary:

A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network that enhances cooling efficiency and minimizes the pressure drop across the device. Experimental test results are presented. Tests to date indicate that up to 76.5 W/cm2 may be removed by the heat sink based on a 100°C electronic device temperature

Notes:

Vendor supplied data

Publisher Number:

1999-01-1408

Access Restriction:

Restricted for use by site license