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Integrating Thermal and Structural Analysis with Thermal Desktop C&R Technologies, Incorporated

SAE Technical Papers (1906-current) Available online

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Format:
Conference/Event
Author/Creator:
Panczak, Tim, author.
Conference Name:
International Conference On Environmental Systems (1999-07-12 : Denver, Colorado, United States)
Language:
English
Physical Description:
1 online resource
Place of Publication:
Warrendale, PA SAE International 1999
Summary:
Structural and thermal engineers currently work independently of each other using unrelated tools, models, and methods. Without the ability to rapidly exchange design data and predicted performance, the achievement of the ideals of concurrent engineering is not possible.Thermal codes have been unable to exploit the geometric information in structural models and the CAD design database, and do not facilitate transfer of temperature data to other discipline's analysis models. This paper discusses the key features in Thermal Desktop for supporting integrated thermal/structural analysis. Approaches to thermal modeling in an integrated analysis environment are discussed along with Thermal Desktop's data mapping algorithm for exporting temperature data on to structural model grid points
Notes:
Vendor supplied data
Publisher Number:
1999-01-2126
Access Restriction:
Restricted for use by site license

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