A Resonating Comb/Ring Angular Rate Sensor Vacuum Packaged Via Wafer Bonding Delphi Delco Electronics Systems

Format:

Book

Conference/Event

Author/Creator:

Zarabadi, S., author.

Conference Name:

International Congress & Exposition (1999-03-01 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource cm

Place of Publication:

Warrendale, PA SAE International 1999

Summary:

The best features of a comb and ring device have been combined to provide an improved micromachined angular rate sensor. The use of differential combs attached to a centrally supported ring gives this electroformed surface micromachine improved signal output and temperature performance. Previous results have been reported for vibratory ring sensors vacuum packaged in solder sealed CERDIPs. Bulk silicon etching and wafer to wafer bonding, used to fabricate millions of pressure sensors and accelerometers each year, have been employed to vacuum package this new CMOS integrated micromachine. Wafer level packaging allows for MEMS chip-scale packaging at the board level. The goal of this project is to develop a low cost sensor capable of reliably functioning at temperatures between -40 °C and 85 °C. The design, modeling, process, package, performance and automotive applications of this sensor will be covered

Notes:

Vendor supplied data

Publisher Number:

1999-01-1043

Access Restriction:

Restricted for use by site license