An Integrated Approach for Thermal Impact Based Reliability Analysis of Electronic Components Uno Minda, Limited

Format:

Book

Conference/Event

Author/Creator:

Mote, Shweta, author.

Contributor:

Chaudhari, Vijay

Jadhav, Shantaram

Mhaske, Aashay

Conference Name:

SAENIS TTTMS Thermal Management Systems Conference (2024-09-19 : Delhi, India)

Language:

English

Physical Description:

1 online resource cm

Place of Publication:

Warrendale, PA SAE International 2024

Summary:

In the rapidly evolving landscape of electronic engineering, the reliability of electronic components under varying thermal conditions has emerged as a paramount concern. This paper presents an integrated approach for the reliability analysis of electronic components, emphasizing thermal impacts. Our methodology synergizes computational thermal analysis, experimental stress testing, and Failure Modes, Effects, and Diagnostic Analysis (FMEDA) to offer a comprehensive framework for assessing and enhancing component reliability, specifically focusing on a case study of motorcycle hand control switches. The approach begins with a detailed thermal simulation to identify potential hot spots and thermal gradients across electronic components under different operational scenarios. For the case study, motorcycle hand control switches a critical interface between the rider and the motorcycle's electrical system were subjected to this analysis to predict thermal behavior under varied environmental and operational conditions. Subsequently, accelerated life testing (ALT) methodologies focusing on thermal cycling and thermal shock tests were employed to empirically validate the simulation results and identify failure mechanisms induced by thermal stress. Through FIT calculation for FMEDA, we integrated these findings to quantify the reliability of the motorcycle hand control switch, considering the identified thermal-induced failure modes and their effects on system performance and safety. This case study highlights the significant improvement in the predictive accuracy of component reliability and the identification of critical thermal management strategies to mitigate failure risks. The results validate our methodology and ensure improved safety and performance. By providing a holistic view that combines theoretical, experimental, and analytical techniques for thermal impact-based reliability analysis. It ensures that thermal considerations are at the forefront of electronic component design and analysis, offering engineers and researchers a robust tool for designing more reliable electronic systems capable of withstanding the rigors of thermal stresses encountered in real-world applications

Notes:

Vendor supplied data

Publisher Number:

2024-28-0098

Access Restriction:

Restricted for use by site license