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Simulation Based Dynamic Thermal Emulation Unit for Thermal Preconditioning and Emulation of Hardware Components on the Thermal Testbed Technische Universitat Darmstadt

SAE Technical Papers (1906-current) Available online

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Format:
Book
Conference/Event
Author/Creator:
Weimer, Niko, author.
Contributor:
Beidl, Christian
Fiore, Luis
Hohenberg, Günter
Seib, Rico
Stenger, Erik
Conference Name:
17th International Conference on Engines and Vehicles (2025-09-14 : Capri, Italy)
Language:
English
Physical Description:
1 online resource cm
Place of Publication:
Warrendale, PA SAE International 2025
Summary:
Electrification of vehicles plays an important role in the transformation process towards sustainable mobility in the individual and transport sector. As a result, new challenges must be met during the development process regarding the vehicles overall energy management system. A key challenge is the development of thermal management systems to optimize overall vehicle efficiency and to minimize ageing effects of the powertrain components while maintaining passenger comfort. Efficiency and ageing effects are highly dependent on the conditioning state of the powertrain components due to their high thermal sensitivity with simultaneously narrow thermal operating limits. Comfort functions like cabin air conditioning must be fulfilled as well, which must be considered by the thermal management system. To develop innovative solutions for thermal management systems at an early stage of the development process, thermal emulation can be used to substitute hardware components. Therefore, thermal representative simulation models calculate the waste heat of the components, which is then transferred to the testbed by thermo-hydraulic emulators. This enables testing of components and systems in early stages of development under real boundary conditions. Furthermore, operation strategies for the thermal management systems, considering interactions between thermally relevant subsystems, can be developed at an early stage. This study shows the development of a compact and scalable thermal emulator as well as the requirements for an optimal development environment at a thermal testbed
Notes:
Vendor supplied data
Publisher Number:
2025-24-0137
Access Restriction:
Restricted for use by site license

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