Highly Integrated Solutions for Tire Pressure Monitoring Systems Freescale Semiconductor, Incorporated

Format:

Conference/Event

Author/Creator:

Shaw, Mark, author.

Conference Name:

Asia Pacific Automotive Engineering Conference (2007-08-05 : Hollywood, California, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2007

Summary:

The US requirement for tire pressure monitoring systems (TPMS) will reach the 100% installation rate this year in accordance with the requirements of FMVSS138 promulgated by the NHTSA. The wide variety of semiconductor technologies available now for direct TPMS can solve the requirements for these systems. However, the wide variation in solutions for TPMS can present a number of end customer issues when there are no standard methods or protocols used in their application. This paper will present an advanced TPMS sensor that includes all of the required features for very complex solutions and presents the issues that result from too many variations in the field. Finally a set of suggested protocols are presented that could help reduce the field issues that may be experienced by the end customer

Notes:

Vendor supplied data

Publisher Number:

2007-01-3638

Access Restriction:

Restricted for use by site license