Direct Bonding of a Multi-Layer Circuit Substrate to a Heatsink Deere and Company

Format:

Conference/Event

Author/Creator:

Godbold, C. V., author.

Conference Name:

SAE 2007 Commercial Vehicle Engineering Congress & Exhibition (2007-10-30 : Rosemont, Illinois, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2007

Summary:

Phoenix International, the electronics manufacturing group of John Deere, has developed a product and manufacturing process to address many of the shortcomings of conventional heatsinking technologies. In this process, a thin circuit board is bonded directly to a flat surface heatsink such as a finned extrusion or liquid-cooled plate. The major benefits of the proposed solution are the simplification of the manufacturing process and substantially improved conduction of heat away from high-power circuitry

Notes:

Vendor supplied data

Publisher Number:

2007-01-4220

Access Restriction:

Restricted for use by site license