Thermal Interface Materials Based on Anchored Carbon Nanotubes Creare Incorporated

Format:

Conference/Event

Author/Creator:

Rozzi, Jay C., author.

Conference Name:

International Conference On Environmental Systems (2007-07-09 : Chicago, Illinois, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2007

Summary:

The new devices and missions to achieve the aims of NASA's Science Mission Directorate (SMD) are creating increasingly demanding thermal environments and applications. In particular, the low conductance of metal-to-metal interfaces used in the thermal switches lengthen the cool-down phase and resource usage for spacecraft instruments. During this work, we developed and tested a vacuum-compatible, durable, heat-conduction interface that employs carbon nanotube (CNT) arrays directly anchored on the mating metal surfaces via microwave plasma-enhanced, chemical vapor deposition (PECVD). We demonstrated that CNT-based thermal interface materials have the potential to exceed the performance of currently available options for thermal switches and other applications

Notes:

Vendor supplied data

Publisher Number:

2007-01-3127

Access Restriction:

Restricted for use by site license