Silicone Thermal Interface Materials For Automotive Electronics Dow Corning Corporation

Format:

Conference/Event

Author/Creator:

Nascimento, Luis Paulo Finatti, author.

Conference Name:

SAE Brasil 2007 Congress and Exhibit (2007-11-28 : Sao Paulo, Brazil)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2007

Summary:

Today one of the key issues facing electronic systems designs is heat dissipation. This is even more critical in Automotive Electronics because smaller and lighter modules coupled with higher component density lead to increased necessity of thermal power dissipation. Electronic modules with greater functionality and power also generate more heat. Higher temperatures can directly affect the performance and reliability of these modules. The unique properties of silicone thermal interface materials - in the form of adhesives, gels, encapsulants, gap fillers and thermal pads - can help automotive engineers get increased heat dissipation with higher levels of flexibility and better physical and electrical performance

Notes:

Vendor supplied data

Publisher Number:

2007-01-2962

Access Restriction:

Restricted for use by site license