Silicone Thermal Interface Materials for Under-Hood Electronics Dow Corning Corporation

Format:

Conference/Event

Author/Creator:

Stephan, Martin, author.

Conference Name:

SAE World Congress & Exhibition (2007-04-16 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2007

Summary:

Heat dissipation is one of the key issues facing automotive engineers, as performance, reliability and longevity of electronic devices have all been shown to be directly affected by temperature. The current thermal challenges are unprecedented, as smaller engine compartments and higher component density raise under-hood temperatures, while electronic devices with greater functionality and power also generate more heat than previous designs. The unique properties of silicone thermal interface materials can help achieve higher levels of physical and electrical performance in automotive electronics -- facilitating heat dissipation in a variety of forms, including adhesives, gels, encapsulants, gap fillers, fabricated pads and phase change materials

Notes:

Vendor supplied data

Publisher Number:

2007-01-0544

Access Restriction:

Restricted for use by site license