Reliability Analysis of Adhesive for PBT-Epoxy Interface DENSO Corporation

Format:

Conference/Event

Author/Creator:

Katō, Kazuo, author.

Conference Name:

SAE World Congress & Exhibition (2007-04-16 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2007

Summary:

AbstractPBT (polybutylene terephthalate) and epoxy adhesive, which both have superior heat resistance and environmental resistance, are a representative combination now being applied to many parts. Generally, PBT is annealed after molding at a temperature above the glass transition temperature to ensure dimensional stability when in use. But in this case, this process decreases the adhesive strength between PBT and epoxy. This study analyzes the adhesion degradation mechanism in this system and a countermeasure technology is proposed.Regarding this PBT-epoxy adhesion degradation mechanism, focus is placed on changes in the fracture surface, which is analyzed before and after annealing. From this analysis it becomes clear that generation of a WBL (weak boundary layer) is caused by non-crystallization and a migration of the PBT functional group on the adhesion surface layer. According to this mechanism, it is clear that control of the functional group on the surface layer and reforming of a new functional group are very effective ways to maintain adhesive strength after annealing

Notes:

Vendor supplied data

Publisher Number:

2007-01-1517

Access Restriction:

Restricted for use by site license