Electronics Cooling Using High Temperature Loop Heat Pipes With Multiple Condensers Advanced Cooling Technologies, Incorporated

Format:

Conference/Event

Author/Creator:

Anderson, Anderson, author.

Contributor:

Ellis, Michael

Hartenstine, John

Montgomery, Jared

Peters, Chris

Conference Name:

Power Systems Conference (2010-11-02 : Fort Worth, Texas, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2010

Summary:

In military aircraft, electronics are often subjected tooperating environments well beyond their survival temperatures andwith limited heat sinks. The current approach is to use a LiquidCooling System (LCS) with either vehicle fuel or Polyalphaolephin(PAO) to cool electronics. However, advanced military platformshave found this approach limits their operational effectiveness. Athermal management system for electronics cooling in hightemperature avionics environments is under development using LoopHeat Pipe (LHP) and heat pipe-based technology. The system reducesthermal energy transport inefficiencies within electronicsenclosures, identifies potential sinks to provide continuous heatrejection over the operating envelope of the platform, and providespassive thermal energy transport from the electronics enclosure toselected sinks.The system developed to accomplish these tasks is divided intotwo subsystems. The first subsystem is responsible for improvingthermal transport within the electronics enclosure and consistsprimarily of heat pipe assemblies. Model results of the firstsubsystem show considerable improvements over the currentimplementation. The overall temperature gradient within a genericelectronics box decreased from 42.7°C (76.9°F) to 17.8°C (32.0°F),increasing the allowable sink temperature from 66.7°C (152.1°F) to91.7°C (197.1°F). This increase allows for more freedom in sinkselection, which is typically limited aboard military platforms.The second subsystem transports thermal energy from the externalsurface of the enclosure to appropriate sinks and consistsprimarily of a LHP. At this stage, several sinks have beenidentified and evaluated. Final sink selection is underway.Depending on sink temperature and capacity throughout the operatingenvelope of the platform, multiple sinks may be used. Duringoperation, the LHP will passively select the appropriate sink

Notes:

Vendor supplied data

Publisher Number:

2010-01-1736

Access Restriction:

Restricted for use by site license