Automotive Amplifier Heatsink Design and Thermal Analysis Research at Transient State Condition Yanfeng Visteon Automotive Electronic Company, Limited Visteon China Technical Center

Format:

Conference/Event

Author/Creator:

Wang, Cheng, author.

Conference Name:

Thermal System Efficiencies Summit (2009-10-01 : Troy, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2009

Summary:

The thermal design requirements at transient state condition are becoming progressively more common in automotive electronic products specifications. For studying the characteristics of heatsink design and CFD thermal analysis in transient state environment, the theories about heat transfer at transient state condition are researched. Some key factors heavily affecting the thermal performance of heatsink are discussed, such as the thickness of heatsink base, the processes of heatsink surfaces and the intervals definitions of whole computation duration in transient state thermal simulation. Then some conclusions of those factors are summarized. Lastly, for an automotive amplifier heatsink design as example, those conclusions are studied and described further based on the correlation of test and analysis results

Notes:

Vendor supplied data

Publisher Number:

2009-01-3077

Access Restriction:

Restricted for use by site license