250 °C SiC Power Module Package Design Virginia Polytechnic Institute and State University

Format:

Conference/Event

Author/Creator:

Ning, Puqi, author.

Conference Name:

Power Systems Conference (2008-11-11 : Seattle, Washington, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2008

Summary:

In order to take full advantage of SiC, a high temperature package for power module using SiC devices was designed, developed, fabricated and tested. The details of the material selection and fabrication process are described. High temperature reliability test and power test shows that the package presented in this paper can perform well at the high junction temperature

Notes:

Vendor supplied data

Publisher Number:

2008-01-2892

Access Restriction:

Restricted for use by site license