The Development of High-Accuracy Warpage Analysis CAE for Large, Thin Plastic Parts General Assembly Engineering Div. Toyota Motor Company

Format:

Conference/Event

Author/Creator:

Takahara, Tadayoshi, author.

Conference Name:

SAE 2005 World Congress & Exhibition (2005-04-11 : Detroit, Michigan, United States)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2005

Summary:

This paper presents an improved CAE method for high-accuracy warpage analysis. The physical properties of the materials that affect warpage are examined, considering the mechanisms at work in each of the three steps of the injection molding process: injection, pressure holding, and cooling/ejection. When a theoretical mechanism is not fully understood and measurements are inaccurate, correction is made based on the measurement values of large, thin parts. This paper describes both the analysis and application from more than two years of study using the new CAE method

Notes:

Vendor supplied data

Publisher Number:

2005-01-1070

Access Restriction:

Restricted for use by site license