Lead Free Cationic Electro-Deposition for Automobile Body in White Honda R&D Company,Ltd

Format:

Conference/Event

Author/Creator:

MORISHITA, Hiroyuki, author.

Conference Name:

International Body Engineering Conference & Exposition (2003-10-27 : Tokyo, Japan)

Language:

English

Physical Description:

1 online resource

Place of Publication:

Warrendale, PA SAE International 2003

Summary:

Organic tin compounds were examined as replacements for the hardening catalyst function of lead in order to produce a lead-free cationic E-coat. The mechanism of the decline in adhesion, at the interface between the anti-chip primer and the primer surfacer, when an organic tin compound migrated to the anti-chip primer layer, was determined. Monobutyl tin compounds were found to have the lowest mobility within the film of organic tin compounds capable of functioning as hardening catalysts. A lead-free E-coat, employing a monobutyl tin compound, demonstrated no decline in adhesion, and the performance of the film was equivalent to that of conventional E-coat

Notes:

Vendor supplied data

Publisher Number:

2003-01-2783

Access Restriction:

Restricted for use by site license