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Proceedings of the Twentieth International Conference on Tangible, Embedded, and Embodied Interaction
- Format:
- Book
- Conference/Event
- Conference Name:
- TEI '26: Twentieth International Conference on Tangible, Embedded, and Embodied Interaction Chicago IL USA 2026
- Series:
- ACM Conferences
- Language:
- English
- Physical Description:
- 1 online resource (1379 pages)
- Other Title:
- TEI '26
- Place of Publication:
- Association for Computing Machinery 2026
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