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Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

MLA

ASTM International. Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation. West Conshohocken, PA ASTM International

APA

ASTM International. (0). Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation. West Conshohocken, PA ASTM International.

Chicago

ASTM International. Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation. West Conshohocken, PA ASTM International

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