Wafers and Substrates / edited by Michele Riccio, Andrea Irace, and Giovanni Breglio.

Format:

Book

Contributor:

Riccio, Michele, editor.

Irace, Andrea, editor.

Breglio, Giovanni, editor.

Language:

English

Subjects (All):

Semiconductors.

Semiconductor wafers.

Plasma etching.

Physical Description:

1 online resource (104 pages)

Edition:

First edition.

Place of Publication:

Baech, Switzerland : Trans Tech Publications Ltd, [2024]

Summary:

Special topic volume with invited peer-reviewed papers only.

Contents:

Intro

Wafers and Substrates

Preface

Table of Contents

SmartSiC™ Substrates: A Boon to Drain Metallization Process

Surface Structuring of Patterned 4H-SiC Surfaces Using a SiC/Si/SiC Sandwich Approach

HYPREZ Wafering Solutions: A Novel Approach of SiC Wafering Solution

Poly-SiC Characterization and Properties for SmartSiC™

Application of Advanced Characterization Techniques to SmartSiC™ Product for Substrate-Level Device Performance Optimization

A Novel Approach for Thin 4H-SiC Foil Realization Using Controlled Spalling from a 4H-SiC Wafer

High-Temperature Reorganization Behavior of Single-Crystalline Porous 4H-SiC Thin Foils

Dicing Process for 4H-SiC Wafers by Plasma Etching Using High-Pressure SF6 Plasma with Metal Masks

Investigations on the Recovery of the Electrical Properties of Smart Cut™-Transferred SiC Thin Film Using SiC-on-Insulator Structures

Demonstration of SiC-on-Insulator Substrate with Smart Cut™ Technology for Photonic Applications

A Novel Contactless SiC Wafer Planarization Processing after Mechanical Slicing by Dynamic Thermal Annealing Processes

Proposal of Damage-Free SiC Wafer Dicing Using Water Jet Guided Laser

In-Line Charaterization of HPSI SiC Wafers Using High Resolution Surface Photovoltage Spectroscopy (HR-SPS)

Characterization of Very Thin 3C-SiC Epilayers on Si

Keyword Index

Author Index.

Notes:

Description based on publisher supplied metadata and other sources.

Description based on print version record.

ISBN:

9783036416342

303641634X

OCLC:

1455118442