1 option
ASME 2009 InterPACK Conference. Volume 1, Advanced packaging ; Electro-thermal-mechanical issues in packaging : multi-physics ; Manufacturing and test ; Materials and processes ; MEMS and MEMS packaging ; Natotechnology and NEMS ; Photonics and optics ; Reliability [electronic resource] : July 19-23, 2009, San Francisco, California, USA.
- Format:
- Book
- Conference/Event
- Conference Name:
- ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2009 : San Francisco, Calif.)
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (995 p.)
- Place of Publication:
- [New York] : ASME, c2009.
- Notes:
- Description based on online resource; title from title screen (ASME, viewed August 28, 2013).
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