2 options
Thermal performance and reliability of bonded interfaces for power electronics packaging applications / Douglas DeVoto.
- Format:
- Book
- Government document
- Author/Creator:
- DeVoto, Douglas, author.
- Series:
- NREL/PR ; 5400-52468.
- NREL/PR ; 5400-52468
- Language:
- English
- Subjects (All):
- Electronic packaging--Materials.
- Electronic packaging.
- Thermal interface materials--United States.
- Thermal interface materials.
- United States.
- Genre:
- Online resources.
- proceedings (reports)
- Conference papers and proceedings
- Conference papers and proceedings.
- Physical Description:
- 1 online resource ([23] pages) : color illustrations.
- Place of Publication:
- [Golden, Colo.] : National Renewable Energy Laboratory, 2011.
- Notes:
- Online resource; title from PDF title page (NREL, viewed Jan. 24, 2017).
- "ASTR 2011 Workshop, Friday, September 30, 2011."
- OCLC:
- 969973002
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.